New silicone-free, high-performance thermal conductive paste

Semiconductor mounting surfaces on components used for component cooling – such as extruded heatsinks, cooling aggregates or liquid-cooled heatsinks – are often subject to manufacturing-related tolerances and frequently require mechanical CNC reworking. A flat, level semiconductor mounting surface plays a fundamental role in ensuring correct and thermally optimal contact between the electronic device and the heatsink. Optimal heat transfer between the device and the heat sink ensures minimal thermal resistance and reliable semiconductor operation within the specified temperature range. To compensate for even the smallest air pockets between the contact pairs, Fischer Elektronik is expanding its extensive product range of thermal interface materials to include a high-performance, silicone- and solvent-free thermal conductive paste. The new thermal paste, with the product code WLPF 36 035, has an excellent thermal conductivity of 3.6 W/m•K and is CRM-free; it is therefore not subject to any additional training requirements. The paste contains no metallic fillers, is electrically insulating and also offers high long-term stability with very good creep properties. The WLPF 36 035 thermal grease can be used within a temperature range of -60°C to +100°C and is supplied in a 35g tin. Other types and sizes of packaging can be produced to customer specifications on request. The innovations listed from the aforementioned product range of thermal conductive materials, as well as all new products from Fischer Elektronik GmbH & Co. KG, can also be found at www.fischerelektronik.de.